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1 School of Engineering and Physical Sciences, Electrical and Electronic Engineering department, Mountbatten Building 2 Merlin Circuit Technology LTD

Abstract : A novel way of filling high aspect ratio vertical interconnection microvias with an aspect ratio of >2:1 is presented. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst-diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. Higher throughput and better control over the deposition properties are possible for the manufacturing of interconnections and metal-based MEMS.

Autor: Jens Georg Kaufmann - Marc Desmulliez - D. Price -



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