SEM and EDS Characterisation of Layering TiOx Growth onto the Cutting Tool Surface in Hard Drilling Processes of Ti-Al-V AlloysReportar como inadecuado




SEM and EDS Characterisation of Layering TiOx Growth onto the Cutting Tool Surface in Hard Drilling Processes of Ti-Al-V Alloys - Descarga este documento en PDF. Documentación en PDF para descargar gratis. Disponible también para leer online.

Advances in Materials Science and EngineeringVolume 2011 2011, Article ID 414868, 10 pages

Research Article

Mechanical Engineering and Industrial Design Department, University of Cadiz, c-Chile 1, 11002 Cadiz, Spain

Department of Mechanical Engineering, University of the Basque Country, Alda. de Urquijo s-n, 48013 Bilbao, Spain

Received 26 April 2011; Revised 22 July 2011; Accepted 22 July 2011

Academic Editor: Daolun Chen

Copyright © 2011 M. Álvarez et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

Scanning electron microscopy SEM has been used to identify and analyse the secondary adhesion effect precursors formed during the dry drilling processes of Ti-6Al-4V alloy over the rake face and flute of the drilling tools. Subsequent analysis with energy dispersive spectroscopy EDS was enabled to distinguish its compositional characteristics. Thus, according to the EDS obtained data, a stratified multi built-up layer MBUL composed by TiOx is formed over the rake face of the tool. Furthermore, this multi-layer adhered allows initially the built-up edge BUE development close to the edge of the tool by a mechanical adhesion mechanism. In a second step, it is responsible for the formation of a thicker secondary BUL which avoids the chip flow, and it provokes the tool collapse. These mechanisms are different from those observed in the dry machining of other alloys such as steels, nickel-based alloys, or aluminium alloys.





Autor: M. Álvarez, J. Salguero, J. A. Sánchez, M. Huerta, and M. Marcos

Fuente: https://www.hindawi.com/



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