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Mathematical Problems in Engineering - Volume 2014 2014, Article ID 728950, 7 pages -

Research Article

College of Electromechanical Engineering, Qingdao University of Science & Technology, Qingdao 266061, China

Department of Mechanical and Aeronautical Engineering, Naval Aeronautical Engineering Academy Qingdao Branch, Qingdao 266041, China

Received 25 September 2013; Revised 24 January 2014; Accepted 12 February 2014; Published 20 March 2014

Academic Editor: Mahmoud Kadkhodaei

Copyright © 2014 Shuangshuang Sun and Xiance Jiang. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

The mechanical model of the shape memory alloy SMA composite film with silicon Si substrate was established by the method of mechanics of composite materials. The coupled action between the SMA film and Si substrate under thermal loads was analyzed by combining static equilibrium equations, geometric equations, and physical equations. The material nonlinearity of SMA and the geometric nonlinearity of bending deformation were both considered. By simulating and analyzing the actuation performance of the SMA composite film during one cooling-heating thermal cycle, it is found that the final cooling temperature, boundary condition, and the thickness of SMA film have significant effects on the actuation performance of the SMA composite film. Besides, the maximum deflection of the SMA composite film is affected obviously by the geometric nonlinearity of bending deformation when the thickness of SMA film is very large.





Autor: Shuangshuang Sun and Xiance Jiang

Fuente: https://www.hindawi.com/



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