Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package - Physics > General PhysicsReport as inadecuate




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Abstract: Subject of this paper is the thermal investigation of epoxy EDA and solderSDA die attaches by a comparison of an ASIC with multiple heat sources indifferent package assemblies. Static and transient thermal measurements andsimulations were performed to investigate the thermal behavior of two samplesin a state of the art QFP power package differing only in the die attachmaterial EDA and SDA.



Author: J. Czernohorsky, B. Maj, Matthias Viering, L. Wright, G. Balanon

Source: https://arxiv.org/







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