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Abstract: Heat generation from electronics increases with the advent of high-densityintegrated circuit technology. To come up with the heat generation, microscalecooling has been thought as a promising technology. Prediction of heat transferrate is crucial in design of microscale cooling device but is not clearlyunderstood yet. This work proposes a new correlation between heat transfer rateand Brinkman number which is nondimensional number of viscosity, flow velocityand temperature. It is expected that the equation proposed by this work can beuseful to design microchannel cooling device.



Autor: H.S. Park

Fuente: https://arxiv.org/







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