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Abstract: This paper describes a novel integrated circuit technology to manufacturehigh-density thermoelectric devices on a semiconductor wafer. With no movingparts, a thermoelectric cooler operates quietly, allows cooling below ambienttemperature, and may be used for temperature control or heating if thedirection of current flow is reversed. By using a monolithic process toincrease the number of thermoelectric couples, the proposed solid-state coolingtechnology can be combined with traditional air cooling, liquid cooling, andphase-change cooling to yield greater heat flux and provide better coolingcapability.



Autor: H. Chen, L. Hsu, X. Wei

Fuente: https://arxiv.org/







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