Interposer With Polymer-filled Or Polymer-lined Optical Through-vias In Thin Glass SubstrateReportar como inadecuado


Interposer With Polymer-filled Or Polymer-lined Optical Through-vias In Thin Glass Substrate


Interposer With Polymer-filled Or Polymer-lined Optical Through-vias In Thin Glass Substrate - Descarga este documento en PDF. Documentación en PDF para descargar gratis. Disponible también para leer online.

An optical interposer that includes a glass substrate having one or more optical vias extending through the glass substrate. A first optical polymer may be bonded to the substrate and to interior surfaces of the one or more optical vias. Implementations include one or more optical via cores comprising a second optical polymer that has a greater refractive index than the first optical polymer. The one or more optical via cores may be at least partially surrounded by the first optical polymer. Embodiments include encapsulated optical waveguides in communication with the optical vias and-or via cores. Example implementations include layers of electrical insulation, electrical traces, and electrical vias. A method of manufacture includes forming the optical vias by laser ablation. Certain embodiments may include chemically etching the inside of the vias to improve surface roughness.



Georgia Tech Patents -



Autor: Tummala, Rao R. - Chou, Chia-te - Sundaram, Venkatesh - -

Fuente: https://smartech.gatech.edu/







Documentos relacionados