Interconnect Assemblies And Methods Of Making And Using SameReportar como inadecuado


Interconnect Assemblies And Methods Of Making And Using Same


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The various embodiments of the present invention provide fine pitch, chip-to-substrate interconnect assemblies, as well as methods of making and using the assemblies. The assemblies generally include a semiconductor having a die pad and a bump disposed thereon and a substrate having a substrate pad disposed thereon. The bump is configured to electrically interconnect at least a portion of the semiconductor with at least a portion of the substrate when the bump is contacted with the substrate pad. In addition, when the bump is contacted to the substrate pad, at least a portion of the bump and at least a portion of the substrate pad are deformed so as to create a non-metallurgical bond therebetween.



Georgia Tech Patents -



Autor: Kumbhat, Nitesh - Choudhury, Abhishek - Sundaram, Venkatesh V. - Tummala, Rao R. - -

Fuente: https://smartech.gatech.edu/







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