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A simple equation for heat spreading angle is derived which is useful forcases with a single layer thermal spreader. The derivation starts withFourier’s heat transfer law. Heat spreading in two dimensions is thenintroduced which results in a quadratic equation relative to spreading angle.The result is a closed form equation for heat spreading angle. Calculationsusing the equation are compared to 3D finite element simulations which show agreementacceptable for most practical applications and over a wide range of physicaldimensions and thermal conductivities. A norma-lized dimensional parameter isdefined which is used to generate a curve fit equation of the spreading angle.A three step procedure is then presented which allows the calculation of thespreading angle and temperature rise in the thermal spreader. The result hasapplication for initial calculations of temperature rise in microwave hybridmodules and electronic packages such as heat sinks for high power amplifiers.This is because it is common for these types of modules and packages to use asingle layer heat spreader in copper-tungsten CuW or copper-molybde-numCuMo connected to a cold plate. An important benefit of this method is thatit allows microwave hybrid designers and high power amplifier packagingengineers a method to quickly perform trade studies to determine the maximummounting temperature for integrated circuits.

KEYWORDS

Heat Transfer, Thermal Analysis, Microwave, Hybrid, Reliability

Cite this paper

Sturdivant, R. , Bogdon, A. and Chong, E. 2016 A Simple Closed Form Solution to Single Layer Heat Spreading Angle Appropriate for Microwave Hybrid Modules. Journal of Electronics Cooling and Thermal Control, 6, 52-61. doi: 10.4236-jectc.2016.62005.





Autor: Rick L. Sturdivant1, Astacian J. Bogdon1, Edwin K. P. Chong2

Fuente: http://www.scirp.org/



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