Thermal-aware 3D Microarchitectural FloorplanningReport as inadecuate

Thermal-aware 3D Microarchitectural Floorplanning

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Next generation deep submicron processor design will need to take into consideration many performance limiting factors. Flip flops are inserted in order to prevent global wire delay from becoming nonlinear, enabling deeper pipelines and higher clock frequency. The move to 3D ICs will also likely be used to further shorten wirelength. This will cause thermal issues to become a major bottleneck to performance improvement. In this paper we propose a floorplanning algorithm which takes into consideration both thermal issues and profile weighted wirelength using mathematical programming. Our profile-driven objective improves performance by 20% over wirelength-driven. While the thermal-driven objective improves temperature by 24% on average over the profile-driven case.

CERCS Technical Reports -

Author: Ekpanyapong, Mongkol - Healy, Michael - Ballapuram, Chinnakrishnan S. - Lim, Sung Kyu - Lee, Hsien-Hsin Sean - Loh, Gabriel H. -


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