Effect of P, Ag on the Oxidation-Resistance of Sn-0.5Cu Lead-Free SolderReport as inadecuate




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Sn-Cu based solder is widely used in wave soldering, however, oxidization is the problem in use. The waste of solder and poor welding quality can be caused by the oxidation of the solder. In this paper, some trace elements P and Ag have been added into the binary alloy Sn0.5Cu to study dynamic oxidation resistance of the solder. Oxidation surface have been examinated by auger electron spectrometer AES to discover the mechanism of improving the solder’s oxidation resistance. The result shows that the trace P can significantly improve the oxidation resistance of Sn0.5Cu alloy, and Ag can both increase the alloy’s oxidation resistance. P and Ag have been simultaneously added into Sn0.5Cu alloy to get a better antioxidant effect that is based on the different anti-oxidation mechanism of the two elements.

KEYWORDS

lead-free solder; Sn-0.5Cu; P; Ag; oxidation-resistance

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Author: Si-dong Liu, Feng Xue, Jian Zhou

Source: http://www.scirp.org/



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