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Maribel Gómez ; Miguel A. Garcia ;Superficies y vacío 2007, 20 (1)

Autor: Jose Mireles Jr.

Fuente: http://www.redalyc.org/


Introducción



Superficies y vacío ISSN: 1665-3521 alex@fis.cinvestav.mx Sociedad Mexicana de Ciencia y Tecnología de Superficies y Materiales A.C. México Mireles Jr., Jose; Gómez, Maribel; Garcia, Miguel A. Packaging investigation and study for optical interfacing of micro components with optical fibers - Part I Superficies y vacío, vol.
20, núm.
1, marzo, 2007, pp.
21-33 Sociedad Mexicana de Ciencia y Tecnología de Superficies y Materiales A.C. Distrito Federal, México Available in: http:--www.redalyc.org-articulo.oa?id=94220104 How to cite Complete issue More information about this article Journals homepage in redalyc.org Scientific Information System Network of Scientific Journals from Latin America, the Caribbean, Spain and Portugal Non-profit academic project, developed under the open access initiative Superficies y Vacío 20(1), 21-33, marzo de 2007 ©Sociedad Mexicana de Ciencia y Tecnología de Superficies y Materiales Packaging investigation and study for optical interfacing of micro components with optical fibers – Part I Jose Mireles Jr.*, Maribel Gómez, Miguel A.
Garcia Centro de Investigación en Ciencia y Tecnología Aplicada (CICTA) de la Universidad Autónoma de Ciudad Juárez Ave.
Del Charro 450 N., Cd.
Juárez Chih.
MEXICO, CP 32310 (Recibido: 17 de diciembre de 2006; Aceptado: 10 de febrero de 2007) An investigation study concerning optical fiber alignment and micro-mirror performance in MOEMS devices is being reviewed in this paper.
The central attention of the study is the analysis of optical fibers positioning, alignment, bonding, optical improvements, coupling to micro-lenses for beam collimation and waveguides.
Also, we highlight features concerning coupling of optical fibers to micro-mirrors while searching for the proper alignment and characterization of the optical beam reflection, its tolerances, relative positioning, and attachment techniques. Keywords: MicroElectroMechanical Systems (MEMS); Packaging; Optical interconnects; OptoEl...





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