Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick PhotoresistsReport as inadecuate




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1

Micro-System Technology Center, Industrial Technology Research Institute. 709 Tainan, Taiwan

2

Institute of Electro-Optical Engineering, National Sun Yat-Sen University, 804 Kaohsiung, Taiwan





*

Author to whom correspondence should be addressed.



Abstract A novel plastic packaging of a piezoresistive pressure sensor using a patterned ultra-thick photoresist is experimentally and theoretically investigated. Two pressure sensor packages of the sacrifice-replacement and dam-ring type were used in this study. The characteristics of the packaged pressure sensors were investigated by using a finite-element FE model and experimental measurements. The results show that the thermal signal drift of the packaged pressure sensor with a small sensing-channel opening or with a thin silicon membrane for the dam-ring approach had a high packaging induced thermal stress, leading to a high temperature coefficient of span TCO response of -0.19% span-°C. The results also show that the thermal signal drift of the packaged pressure sensors with a large sensing-channel opening for sacrifice-replacement approach significantly reduced packaging induced thermal stress, and hence a low TCO response of -0.065% span-°C. However, the packaged pressure sensors of both the sacrifice-replacement and dam-ring type still met the specification -0.2% span-°C of the unpackaged pressure sensor. In addition, the size of proposed packages was 4 × 4 × 1.5 mm3 which was about seven times less than the commercialized packages. With the same packaging requirement, the proposed packaging approaches may provide an adequate solution for use in other open-cavity sensors, such as gas sensors, image sensors, and humidity sensors. View Full-Text

Keywords: pressure sensor; photoresist; packaging pressure sensor; photoresist; packaging





Author: Lung-Tai Chen 1,2, Jin-Sheng Chang 1, Chung-Yi Hsu 1 and Wood-Hi Cheng 2,*

Source: http://mdpi.com/



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