Hydrophilic Surface Modification of PDMS Microchannel for O-W and W-O-W EmulsionsReportar como inadecuado

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School of Mathematics and Statistics, Hicks Building, University of Sheffield, Sheffield S3 7RH, UK


Department of Physics and Applied Mathematics, Pakistan Institute of Engineering and Applied Sciences, Islamabad 45650, Pakistan


Department of Physics, COMSATS Institute of Information Technology, Islamabad 45650, Pakistan


Department of Chemistry and Applied Biosciences, Institute of Chemical and Bioengineering, ETH Zurich, Ramistrasse 101, 8092 Zurich, Switzerland


Department of Chemical and Biological Engineering, University of Sheffield, Sheffield S1 3JD, UK

These authors contributed equally to this work.


Author to whom correspondence should be addressed.

Academic Editor: Fan-Gang Tseng

Abstract A surface modification method for bonded polydimethylsiloxane PDMS microchannels is presented herein. Polymerization of acrylic acid was performed on the surface of a microchannel using an inline atmospheric pressure dielectric barrier microplasma technique. The surface treatment changes the wettability of the microchannel from hydrophobic to hydrophilic. This is a challenging task due to the fast hydrophobic recovery of the PDMS surface after modification. This modification allows the formation of highly monodisperse oil-in-water O-W droplets. The generation of water-in-oil-in-water W-O-W double emulsions was successfully achieved by connecting in series a hydrophobic microchip with a modified hydrophilic microchip. An original channel blocking technique to pattern the surface wettability of a specific section of a microchip using a viscous liquid comprising a mixture of honey and glycerol, is also presented for generating W-O-W emulsions on a single chip. View Full-Text

Keywords: microchannel; microplasma; wettability microchannel; microplasma; wettability

Autor: Shazia Bashir 1,2,†,* , Muhammad Bashir 3,†, Xavier Casadevall i Solvas 4, Julia M. Rees 1 and William B. Zimmerman 5

Fuente: http://mdpi.com/


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