Effects of Reflow Time on the Interfacial Microstructure and Shear Behavior of the SAC-FeNi-Cu JointReportar como inadecuado




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1

School of Mechanical and Electrical Engineering, Shanghai Dianji University, Shanghai 201306, China

2

School of Material and Science Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, China





*

Author to whom correspondence should be addressed.



Academic Editor: Giuseppe Casalino

Abstract Effects of reflow time on the interfacial microstructure and shear strength of the SAC-FeNi-Cu connections were investigated. It was found that the amount of Cu6Sn5 within the solder did not have a noticeable increase after a long time period of reflowing, indicating that the electro-deposited FeNi layer blocked the Cu atoms effectively into the solder area during a long period under liquid-conditions. The ball shear test results showed that the SAC-FeNi-Cu joint had a comparable strength to the SAC-Cu joint after reflowing, and the strength drop after reflowing for 210 s was less than that of the SAC-Cu joint. View Full-Text

Keywords: FeNi; UBM; IMCs FeNi; UBM; IMCs





Autor: Yunxia Chen 1,* , Xulei Wu 2, Xiaojing Wang 2 and Hai Huang 2

Fuente: http://mdpi.com/



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