Die attach using silver sintering. Practical implementation and analysisReportar como inadecuado




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1 Ampère 2 IMS - Laboratoire de l-intégration, du matériau au système 3 SAFRAN, Grp Hispano Suiza

Abstract : Silver sintering is a promising alternative to high melting point HMP solders which contain lead. Indeed, it offers better thermal and electrical properties, and can operate at higher temperature. Currently, several implementations of this technique are available, based on various silver particles sizes and sintering additives. This paper presents a review of the different implementations, and gives practical details about one of them, based on silver nanoparticles. One specific aspect is highlighted: the metal finish of the DBC substrate. It has a major impact on the quality of the sintered joint: with some finishes, the adhesion is excellent more than 50 MPa, while it is poor with some others lower than 10 MPa.

Keywords : power electronics packaging silver sintering high temperature





Autor: Amandine Masson - Wissam Sabbah - Raphaël Riva - Cyril Buttay - Stephane Azzopardi - Hervé Morel - Dominique Planson - Régis M

Fuente: https://hal.archives-ouvertes.fr/



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