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ElectroComponent Science and Technology - Volume 9 1981, Issue 2, Pages 131-137

ITT Components Group, Standard Elektrik Lorenz AG, Nuremberg, Germany

Received 10 November 1980; Accepted 11 May 1981

Copyright © 1981 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Thick film technology has been known for about 20 years. The technique of inks, printing, firing and trimming hasgrown in this time to a well established state of the art. This paper gives an overview of the status today and an outlookinto the future, not only for thick film, but also for hybrids built out of thick film circuits with incorporation ofadditional components. The paper gives the main market figures and market segments for thick film applications andmentions the main reasons for this. New fields of applications for thick film will be found in the future whereconsiderations like reliability, space savings and cost advantage are of importance.

Autor: J. Novotny



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