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Advances in Materials Science and EngineeringVolume 2013 2013, Article ID 830891, 10 pages

Research Article

Department of Industrial and Systems Engineering, Chung Yuan Christian University, Chung Li 32023, Taiwan

Department of Industrial Engineering and Management, National Chin-Yi University of Technology, Taichung 41170, Taiwan

Department of Industrial Engineering and Management, Dayeh University, Changhua 51591, Taiwan

Received 12 August 2013; Accepted 27 October 2013

Academic Editor: Caner Simsir

Copyright © 2013 Yung-Tsan Jou et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


SMT is an assembly technology for core circuit board parts. Unless process parameters are effectively controlled, poor solderability may result in a decline in product quality. This study looks at an SMT manufacturing process in a multinational company. First, the TRIZ contradiction matrix is revised to investigate the association between the 39 parameters in the contradiction matrix and 13 parameters that influence the unevenness of solder paste in the solder paste printing process. Expert verification is then used to screen the key factors affecting the quality of SMT, which are then combined with Taguchi-s method to identify the optimal parameter set influencing the thickness of SMT solder paste. Results. TRIZ identifies squeegee pressure, ejection speed, squeegee speed, and squeegee angle as the four parameters with the greatest influence on SMT solder paste thickness. Taguchi-s method is used to identify the optimum levels set for the experimental factors and carry out confirmation experiments. The S-N ratio improved from 21.732 db to 26.632 db, while the mean also improved from the current 0.163 mm to 0.155 mm, close to the target value of 0.15 mm. The results show that applying TRIZ and Taguchi-s method for the purpose of product improvement is feasible.

Autor: Yung-Tsan Jou, Wen-Tsann Lin, Wei-Cheng Lee, and Tsu-Ming Yeh



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