Automatic Production System for Circuit Boards With Universal Hybrid Integrated CircuitsReport as inadecuate

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ElectroComponent Science and Technology - Volume 8 1981, Issue 1-2, Pages 37-44

Sony Corporation, Tokyo, Japan

Copyright © 1981 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


In the 1970's, much development occurred in monolithic IC's and automatic insertion machines, which brought aboutextensive changes among mass producers of electronic consumer products and greatly influenced the improvement ofquality and the saving of labor in production. The challenges of the next era are the achievement of the following fourobjectives in addition to the quality improvement and labor saving objectives involved in the recent decade. 1 Theefficient use of material resources to eliminate waste, 2 elevation of reliability, 3 striving for uniform specifications forcomponents on a worldwide basis to achieve more rational and efficient operations, and 4 the creation of uniqueproducts through new mounting and assembly techniques. Towards these objectives, a unique technology has beendeveloped which has been named ‘universal hybrid integrated circuits’ UHIC, for which the automatic productionsystem has been put into practical use. The various components used in assembling through this system are cylindricalin shape and entirely new in concept. They are called ‘metal electrode facebonding’ MELF type components. Thenew production system has the capacity of mounting 600 components simultaneously and can handle circuitboards up to a size of 330 millimeters per side. This means that a stereo unit or a color television set can easily beassembled on one circuit board, which could be called “all-in-one UHIC”.

Author: Mitsuo Ohsawa



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