An Installed Tape Automated Bonding UnitReport as inadecuate




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ElectroComponent Science and Technology - Volume 6 1980, Issue 3-4, Pages 159-163

Cii-Honeywell Bull, 20 rue Dieumegard, Saint-Ouen 93406, France

Received 27 April 1979

Copyright © 1980 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

The Tape Automated Bonding TAB was developed and industrialized to achieve a higher packaging density incomputer applications. After elaboration and testing of the prototype units, significant work was done to transferall the activity into production.

After a brief review of the principle of TAB technology the main characteristics of the manufacturing site arepresented and the most significant equipments developed for production needs are briefly described. It becomesapparent that TAB and micropackaging technology are not limited to computers but can be considered in manyother microelectronic applications.





Author: Karel Kurzweil

Source: https://www.hindawi.com/



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