Finite Element Analysis and Simulation about Microgrinding of SiCReportar como inadecuado

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Journal of Nanomaterials - Volume 2015 2015, Article ID 575398, 9 pages -

Research ArticleSchool of Mechanical Science and Engineering, Jilin University, Changchun 130025, China

Received 16 February 2015; Revised 18 June 2015; Accepted 29 June 2015

Academic Editor: Takuya Tsuzuki

Copyright © 2015 Shijun Ji et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


The application of silicon carbide SiC is often limited due to its low machining efficiency and unpredictability about the results of the grinding process. The aim of this paper is to set up finite element analysis models FEM about microgrinding process of SiC, to study the change processes about tangential and normal grinding force which can lead to stress and strain inside SiC material under different grinding parameters, and to predict the results before the grinding process. Adaptive remeshing technique is used to minimize the computational time without sacrificing the accuracy of the results in the simulation of SiC grinding process. The research results can be used to choose reasonable grinding parameters based on the required surface quality.

Autor: Shijun Ji, Leilei Liu, Ji Zhao, and Changrui Sun



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