Sintering Bonding Process with Ag Nanoparticle Paste and Joint Properties in High Temperature EnvironmentReportar como inadecuado

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Journal of Nanomaterials - Volume 2016 2016, Article ID 5284048, 8 pages -

Research Article

Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China

Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA 90089, USA

Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, Canada N2L 3G1

Received 4 November 2015; Revised 15 December 2015; Accepted 31 January 2016

Academic Editor: Jinting Jiu

Copyright © 2016 Jianfeng Yan et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Ag nanoparticle paste is prepared based on the polyol method and subsequent concentration by centrifuging. The sintering bonding process using Ag nanoparticle paste at different bonding pressures is studied. The joint strengths are increased as the bonding pressure increases from 0 MPa to 7.5 MPa. This is due to the fact that the higher assistant bonding pressure is beneficial to the growth of neck size between the adjacent particles and forms denser sintered Ag layers. The joint strength bonded under 10 MPa is lower than that bonded under 7.5 MPa, which may be due to the residue of organic component in the sintered Ag layer. The joint properties bonded with Ag nanoparticle paste in high temperature environment are evaluated by heat treatments at temperatures ranges of 200–350°C for 50 hours. The results show that the mechanical properties of joint with Ag nanoparticle paste are better than the joint with Pb95Sn5 solder after storage at high temperatures.

Autor: Jianfeng Yan, Dongyue Zhang, Guisheng Zou, Lei Liu, Hailin Bai, Aiping Wu, and Y. Norman Zhou



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