EMC-signatures of microcontrollers under thermal stress analyzed by FSVReportar como inadecuado




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(2011)8th international workshop on electromagnetic compatibility of integrated circuits, Proceedings. Mark abstract The EMC-signature of devices containing microcontrollers can differ due to thermal or mechanical stress. Research is presented to prove the feature selective validation method (FSV) to be sensitive enough to analyze differences in signatures.

Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-1905269



Autor: Jos Knockaert , Mohamed Malki, David Baudry, Mohamed Ramdani and Davy Pissoort

Fuente: https://biblio.ugent.be/publication/1905269



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