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Journal of Electronic Materials

, Volume 42, Issue 12, pp 3582–3592

First Online: 30 August 2013Received: 10 January 2013Accepted: 23 July 2013


The objective of this study is to optimize the Cu-Sn solid–liquid interdiffusion process for wafer-level bonding applications. To optimize the temperature profile of the bonding process, the formation of intermetallic compounds IMCs which takes place during the bonding process needs to be well understood and characterized. In this study, a simulation model for the development of IMCs and the unreacted remaining Sn thickness as a function of the bonding temperature profile was developed. With this accurate simulation model, we are able to predict the parameters which are critical for bonding process optimization. The initial characterization focuses on a kinetics model of the Cu3Sn thickness growth and the amount of Sn thickness that reacts with Cu to form IMCs. As-plated Cu-Sn samples were annealed using different temperatures 150°C to 300°C and durations 0 min to 320 min. The kinetics model is then extracted from the measured thickness of IMCs of the annealed samples.

KeywordsIntermetallic formation SLID bonding Cu-Sn bonding Pb-free solder  Download to read the full article text

Autor: Thi-Thuy Luu - Ani Duan - Knut E. Aasmundtveit - Nils Hoivik

Fuente: https://link.springer.com/

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