WCCo-cBN composites produced by pulse plasma sintering methodReport as inadecuate

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Journal of Materials Science

, Volume 47, Issue 20, pp 7064–7071

First Online: 23 May 2012Received: 22 October 2011Accepted: 24 April 2012


WCCo-cBN composites have been considered as a next-generation material for use in cutting-tool edges, being characterized by an optimal combination of hardness and toughness. They can be used instead of WCCo-diamond composites in machining of iron-based materials. The major challenge in sintering these composites is to produce a well-bonded interface between the WCCo matrix and cBN particles. In this study, WCCo-cBN composites were fabricated by the pulse plasma sintering technique. The aim of this work is to obtain sintered parts with density near the theoretical value and with very good contact between the cBN particles and WCCo matrix. cBN-cemented carbide containing 30 vol.% of cBN particles was produced using a mixture of 6 and 12 wt.% Co-added WC powder, with WC grain size of 0.4 μm and cBN powder with grain size ranging from 4 to 40 μm. Scanning electron microscopy SEM observations of the microstructure and diffraction phase examinations did not show the presence of hBN phase. The specific heating conditions used to consolidate the material using high-current pulses hamper the transformation of cBN into hBN and ensure a strong bond between the cBN particles and the cemented carbide matrix. Fractures through the WCCo-cBN composite showed that only few cBN particles were torn out from the cemented carbide matrix, with most of them having been cleaved along the fracture plane. This provides evidence that the bond at the WCCo-cBN interface is mechanically strong. Composites sintered at temperature of 1,200 °C under pressure of 100 MPa for 5 min had density near the theoretical value. Increase of the sintering temperature to 1,200 °C resulted in an increase of the hardness to 2,330 HK1 for the WC6Co-cBN1-3 composite and to 2,160 HK1 for the WC6Co-cBN37-44 composite.

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Author: Marcin Rosinski - Andrzej Michalski

Source: https://link.springer.com/

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